NXP i.MX93 series equipped OSM【OSM-IMX93】
NXP i.MX93 series processor equipped OSM R1.1 Size L module
The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.
basic information
NXP i.MX93 Series Processor Equipped OSM R1.1 Size L Module 【Features】 - NXP i.MX93 series with dual-core Arm Cortex-A55 and M33 - In-SoC Arm Ethos U-65 microNPU - Compliant with OSM Revision 1.1 - LVDS, DSI graphic output - Dual GbE (one with TSN support) - Robust operating temperature options: -40℃ to 85℃ - 15 years of product supply
Price information
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Model number/Brand name
OSM-IMX93
Applications/Examples of results
The OSM-IMX93, boasting the highest safety standards with an independent security island and robust operating temperature options (-40℃ to 85℃), is the ideal solution for various edge AI applications.
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ADLINK Japan will exhibit at the Arm Tech Symposia Tokyo held on November 7th (Thursday)!
On November 7, 2024 (Thursday), the "Arm Tech Symposia Tokyo" will be held at the Tokyo Conference Center, Shinagawa. This event will feature keynote speeches, panel sessions, and breakout sessions by Arm executives and guest speakers, and ADLINK plans to showcase a variety of Arm-based products. 【Exhibited Products】 OSM Module【OSM-IMX93】 COM-HPC Module【COM-HPC-ALT】 SMARC Module【LEC-IMX95】 Development Kit【I-Pi SMARC IMX8MP】 Development Kit【I-Pi SMARC RB5】 Development Kit【I-Pi SMARC 1200】 IoT Gateway【MXA-200】 Ampere Altra Developer Platform【AADP】
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ADLINK leads the embedded computing market with the 662-pin OSM form factor of the SGET standard.
The compact 45mm x 45mm Open Standard Module (OSM) streamlines production with a modular system that has no overhead, providing 662 pins for miniaturization and enhancement of IoT applications. ADLINK is a pioneer of the OSM form factor, offering the OSM-IMX93 and OSM-IMX8MP, each equipped with the NXP i.MX 93 and NXP i.MX 8M Plus, respectively, demonstrating continuous breakthroughs in embedded computing.
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