COM Express Type6 【Express-PTL】
Intel Core Ultra Processor Series 3 COM Express R3.1 Type 6 Basic Size Module
ADLINK's Express-PTL is a next-generation COM Express Type 6 computer-on-module equipped with the Intel Core Ultra Series 3 (Panther Lake-H) processor, achieving a significant leap in performance for edge AI and advanced embedded systems. It features a powerful hybrid CPU architecture with P, E, and low-power LPE cores, supporting up to 128GB of DDR5 memory and IBECC, ensuring high reliability and efficiency. The Express-PTL integrates the next-generation Intel Arc Xe3 GPU, which delivers up to 1.5 times the graphics performance, and an NPU with up to 180 TOPS, enabling fast and efficient AI inference, computer vision, and graphics-intensive workloads within a compact, standard-based COM Express form factor. The Express-PTL supports a rich array of high-speed I/O, including industrial features such as PCIe Gen4, multiple display options, USB4/Thunderbolt capabilities (build options), TSN Ethernet, TPM 2.0, and advanced power management.
basic information
- Intel Core Ultra Processor Series 3 (up to 16 cores: 4P + 8E + 4LPE), TDP 15-65W - Intel Arc Xe3 graphics with up to 120 TOPS, Intel NPU 5.0 with up to 50 TOPS - Supports up to 128GB (2x 64GB) DDR5 SO-DIMM memory, up to 7200MHz, IBECC (for some SKUs) - Supports USB4, DP, HDMI, DVI, VGA, LVDS, eDP (build options) - TSN-compatible 2.5GbE Ethernet - COM Express R3.1 compliant Basic size (125mm x 95mm) - Extremely robust operating temperature range: -40℃ to 85℃ (for some SKUs) - 10 years of product supply
Price information
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Applications/Examples of results
The specific SKU operates in an extended temperature range of -40°C to 85°C, making it ideal for mission-critical applications in robotics, industrial automation, medical imaging, transportation, and smart infrastructure. The Express-PTL, which achieves a balance of AI acceleration, graphics performance, and long-term embedded reliability, provides a forward-looking foundation for scalable edge computing designs.
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ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
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ADLINK releases the first Intel Core Ultra series 3COM Express module for edge AI.
● Achieves up to 180 TOPS for complex edge AI workloads ● Simplifies system integration, especially for graphics-intensive applications, with Intel Arc GPU featuring up to 12 Xe cores ● Maximizes power efficiency and responsiveness with an advanced hybrid CPU architecture (P/E cores and LPE cores) combined with 128GB DDR5 memory ● Adds industrial temperature-rated SKUs. Equipped with IBECC memory and TSN Ethernet, ideal for mission-critical robust applications ● Implements Intel Core Ultra Series 3 in a compact COM-HPC Mini form factor, designed for space-constrained applications. Expected to be available in Q2 2026
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