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1～12 item / All 12 items
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Improving the adhesion between the substrate and the resin composition! Coupling agent "Plenact"
The dispersant covers the surface of the powder and reduces surface activity, thereby improving the wettability of the powder with resin and solvent!
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Reducing the viscosity of a formulation with a high filling of functional fillers 'Plenact'
The titanate and aluminate coupling agent "Plenact" modifies the surface of inorganic fillers to improve compatibility with organic matrices.
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Uniformly dispersing carbon fillers! Polymer-based dispersant "Ajispar."
For those struggling with the dispersion of carbon fillers such as CNT and CB! A polymer dispersant that enables uniform dispersion of conductive fillers.
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Uniformly dispersing pigments in resins, solvents, etc.! Polymer-based dispersant "Ajispar."
For use in organic inks. It helps to uniformly disperse pigments in resins, solvents, etc., and also aids in reducing the viscosity of formulations with high filler content.
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For those having trouble with temporary fixing and alignment, plain set UV heat combined type.
- Temporary fixation and active alignment are possible using UV. - Areas not exposed to UV can be fully cured at a low temperature of 80°C.
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Achieving both pot life and low-temperature curing! "Potential Curing Agent Amicure"
A potential curing agent that can create a one-component epoxy resin formulation with excellent curing properties and long-term storage capability, and is also applicable to resin formulations that can be stored at room temperature.
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For those struggling with solder connections! A one-component conductive adhesive that can cure at low temperatures.
[Exhibition Participation] No need for reflow or flux cleaning! Reduction of processes and use of materials with low heat resistance is possible. "Plain Set - Conductive Type"
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Are you having trouble with connection reliability between terminals? Conductive adhesive that can cure at low temperatures.
"Plain Set Conductive Type" excels in adhesion to various terminals such as gold, copper, nickel, and tin, and offers excellent connection reliability.
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Are you struggling with sealing water vapor? One-component epoxy resin gas barrier adhesive.
Ideal for sealing devices against water vapor and gas, as well as for airtight sealing of vents and through-holes! "Plain Set Gas Barrier Type"
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Are you having trouble bonding with different materials? One-component flexible epoxy resin adhesive.
Exhibits rubber-like flexibility and low elasticity! Effective for bonding heterogeneous materials with a large difference in thermal expansion coefficients. "Plain Set - Flexible Type"
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Are you struggling with the heat resistance of components? Adhesive materials that can cure at low temperatures.
Shortening the curing process! Achieving application to materials with low heat resistance and suppression of warping and deformation due to thermal stress. Epoxy-based thermosetting adhesives and sealants.
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A one-component heat-curing epoxy resin adhesive proposed by Ajinomoto Fine-Techno.
Achieve 60℃ curing! A one-component epoxy adhesive that contributes to effective resource utilization and waste reduction!
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