Recommended PC for COMSOL Multiphysics
Applied Original HPC 【Product Information】
Our company has been manufacturing custom order HPC products at our own factory since our establishment. Recommended PC for running COMSOL Multiphysics, which enables the analysis of a wide range of physical phenomena using the finite element method. COMSOL Multiphysics includes basic functionalities with physical models for fluid dynamics, structures, electromagnetic fields, thermoelectricity, convection and diffusion, acoustics, and more, making it a simulation software capable of analyzing various physical phenomena. We propose HPC solutions suitable for COMSOL Multiphysics, which emphasizes CPU cores and memory. <Featured Models> ■ Model equipped with Xeon Silver 4316 processor for general-purpose physical simulation "COMSOL Multiphysics" based on the finite element method (FEM) ■ Model equipped with dual Xeon Silver 4416 processors for general-purpose physical simulation "COMSOL Multiphysics" based on the finite element method (FEM) *For more details, please refer to the PDF document.
basic information
COMSOL Multiphysics is a powerful simulation software for multiphysics analysis, characterized by its ability to analyze phenomena where multiple physical phenomena are coupled together. Applied's Original HPC [Product Information] <Featured Models> ■ Model equipped with Xeon Silver 4316 processor for general-purpose physical simulation "COMSOL Multiphysics" based on the finite element method (FEM) ■ Model equipped with dual Xeon Silver 4416 processors for general-purpose physical simulation "COMSOL Multiphysics" based on the finite element method (FEM) *For more details, please refer to the PDF document.
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Model number/Brand name
APPLIED Workstation CERVO
Applications/Examples of results
COMSOL Multiphysics is a powerful simulation software for performing multiphysics analysis, characterized by its ability to analyze phenomena where multiple physical phenomena are coupled together. The greatest feature of COMSOL is its capability to couple different physical phenomena (such as electromagnetic fields, heat conduction, fluid dynamics, and structural mechanics) for analysis. This enables simulations that are closer to real-world phenomena, allowing for simultaneous analysis of thermal stress and electromagnetic heating, for example.
