9K High-Speed High-Sensitivity CoaXPress TDI Line Scan Camera
9K 526kHz TDI line scan camera achieving overwhelming speed
■Features This is a super high-speed, high-sensitivity 9k TDI line scan camera equipped with GPixel's CMOS sensor GLT5009BSI. It has a horizontal resolution of 9072 pixels with a 5×5μm back-illuminated CMOS, capable of capturing images at a maximum of 526kHz when using CXP-12×4Lane output. With both 256-stage and 32-stage TDI transfer options, there is no need for expensive high-intensity lighting that requires cumbersome maintenance, allowing for a reduction in total costs. It is ideal for high-speed imaging in low-light conditions, inspection of large objects, and applications that require even higher speed and sensitivity than existing line scan cameras.
basic information
【Features】 ■ High-speed, high-sensitivity monochrome TDI line scan camera ■ Horizontal resolution of 9072 pixels and 288 TDI transfer stages (256+32) ■ Maximum output of 526 kHz with CXP-12×4Lane connection ■ Lens mount options available: M58/M72 ■ CXP-12×4Lane (MicroBNC connector) ■ Compliant with CoaXPress 1.1
Price range
Delivery Time
Model number/Brand name
BL-GM9KTD12X4
Applications/Examples of results
Industrial image processing focused on semiconductors and electronics, including semiconductor inspection, panel inspection, and surface inspection.
Line up(1)
| Model number | overview |
|---|---|
| BL-GM9KTD12X4 | 9k / mono / 526kHz / M58, M72 mount / CXP-12 / MicroBNC connector |
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Notice of Participation in Nepcon Japan 2026 | January 21 (Wed) - 23 (Fri) Tokyo Big Sight
We will be exhibiting at "Nepcon Japan 2026," which will be held at Tokyo Big Sight from January 21 (Wednesday) to 23 (Friday), 2026. We will focus on showcasing the following products, so please be sure to visit our booth. - 105MP/245MP ultra-high-resolution sensor CoaXPress area scan cameras - 10MP/14MP/21MP ultra-high-speed CoaXPress area scan cameras - 8k TDI 1MHz CoaX over Fiber 100G line scan cameras - 2k & 4k CoaXPress line scan cameras - DLP projectors, 3D-Camera series ◇◆Nepcon Japan 2026 □ Dates: January 21 (Wednesday) to 23 (Friday), 2026, 10:00 AM to 5:00 PM □ Venue: Tokyo Big Sight, East Exhibition Hall, E10-37 For details and visitor registration, please visit ➤ https://www.nepconjapan.jp/tokyo/ja-jp.html#/ Please take this opportunity to see our industrial cameras, designed and developed in Japan, which combine performance, quality, cost, and delivery time at a high level, focusing on CoaXPress cameras!
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Notice of Participation in the International Image Device Exhibition | December 3 (Wed) - 5 (Fri) at Pacifico Yokohama
We will be exhibiting at the "International Image Device Exhibition 2025" held at Pacifico Yokohama from December 3 (Wednesday) to December 5 (Friday), 2025. We will be showcasing the following products, so please stop by our booth. - 105MP/245MP ultra-high-resolution sensor CoaXPress area scan cameras - 10MP/14MP/21MP ultra-high-speed CoaXPress area scan cameras - 8k TDI 1MHz CoaX over Fiber 100G line scan cameras - 2k & 4k CoaXPress line scan cameras - DLP projectors, 3D-Camera series ■ Event Dates December 3 (Wednesday) to December 5 (Friday), 2025 / 10:00 AM to 5:00 PM ■ Venue / Booth Number Pacifico Yokohama Exhibition Hall D / "8" ■ Exhibition Website URL https://www.adcom-media.co.jp/ite/ Please take this opportunity to see our industrial cameras, designed and developed in Japan, which combine high performance, quality, cost, and delivery time!
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We focus on the design, development, manufacturing, and sales of high-speed, high-resolution, and highly reliable machine vision cameras primarily using CoaXPress and CameraLink. In addition to developing standard products, we also offer development and customization tailored to customer requests. All camera design and development is carried out by our Japanese staff, ensuring design and production techniques that guarantee delicate and highly reliable standards in Japan, while integrating the dynamic action and speed of China to provide competitive products. At Japan Bopixel, we have successfully become the first camera manufacturer to utilize Ultra Low Power FPGA instead of the standard FPGA adopted by the majority of camera manufacturers. This Ultra Low Power FPGA reduces power consumption by over 50% compared to similar class FPGAs, significantly lowering power consumption and heat generation in cameras by addressing the heat source at its root. By actively adopting these next-generation key devices, we are taking a new approach to the heat generation issues that have traditionally been a challenge.






































