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Essential measurement of additive concentration for plating solution analysis! Supports two-component and three-component additives (inhibitors, accelerators, leveling agents). Compatible with major additive manufacturers!

Various methods such as DT method, MLAT method, and RC method can be used to analyze the concentration of each additive in the plating solution. 【Device Overview】 ■ Organic Components - Brightener (Brightener, Accelerator, Additive) - Suppressor (Suppressor, Carrier, Polymer) - Leveler (Leveler) ■ Inorganic Components - Chloride (Chloride) - Acid (Acid) - Copper (Copper) *For more details, please refer to the catalog or feel free to contact us.

Improves resolution and alignment accuracy, compatible with mass production processes. Adopts UV-LED light sources to reduce running costs.

Applications: Semiconductor backend processes, RF filters, power semiconductors, electronic components, packaging, research, MEMS Supported substrates: Wafers (including special wafers) of various sizes, glass, organic substrates, etc. Our company also offers custom design, lens design, manufacturing, sales, and sales of LED light sources. For more details, please feel free to contact us.

We introduce a lineup of various substrate warpage measurement devices manufactured by Akrometrix! There are a total of four types.

For more details, please contact us or download the catalog.

You can select a measurement method that suits your measurement application (sample). Measurements can be taken under various conditions such as implemented products, strain, and when cooled!

For more details, please contact us or download the catalog.

Introducing a high-performance film thickness measurement device that allows for the "easy" and "quick" measurement of various metal oxide films and metal films using the continuous electrochemical reduction method!

【Metal Film Thickness Measurement Possible Metals】 [About Metal Film Thickness Measurement] ○ Gold : Min 40Å (0.004μm)～ ○ Copper : Min 200Å (0.020μm)～ ○ Nickel : Min 200Å (0.020μm)～ ○ Silver : Min 200Å (0.020μm)～ ○ Tin : Min 200Å (0.020μm)～ 【Applications】 - Analysis of connection failures due to mounting - Degree of oxide film growth during reflow temperature rise associated with lead-free processes - Analysis of tin-copper alloy growth - Analysis of S (sulfide) not obtainable by other analyzers - Confirmation of the presence of organic protective films 【Analysis Items】 - Lead frames - Pre-mount substrates - Post-mount substrates (NG products) - Wafers - BGA (100μm balls) - Bonding wires etc. 【Features】 - Non-destructive type - Short measurement time - No restrictions on usage environment - No safety hazards in handling - Compliant with Mil Spec 55110E 【Others】 〇 Parameters for aluminum oxide films and others are under development. ● For more details, please contact us or download the catalog.

Measuring the warping of the substrate during heating using shadow moiré measurement! ◆Warping data obtained in about 2 seconds per point! ◆Achieving a resolution of 0.5 microns!

【Features】 ○ Maximum measurement field of view: 375×375mm (during shadow moiré) ○ Analysis under thermal conditions that replicate the reflow process (heating temperature: room temperature to 300℃) ○ Warpage data acquisition time: approximately 2 seconds per point ○ Simultaneous measurement of multiple samples is possible 〇 Achieves a resolution of 0.5 microns 〇 Measurement can be performed at the same resolution regardless of the measurement field of view (no lens switching required) ● For more details, please contact us or download the catalog.

Automation is possible at various points! Instant measurement of copper film thickness and the potential for increased production efficiency through advanced statistical processing is here!

【Specifications】 ○Minimum required area: 12.7mm × 12.7mm ○Measurement accuracy: ±5% ○Measurement range: 2.5μm to 200μm ○Probe size: 63mmL × 20φ ●For more details, please contact us or download the catalog.