Porous silicon formation device (anodization device)
A porous silicon formation device that further applies conventional anodic oxidation equipment. Porous silicon wafers are formed depending on the chemical solution used and the current density.
The anodizing device was traditionally a device that flowed current to form an oxide film, but the further developed porous silicon formation device is one that forms porous silicon by changing the chemical solution used and the current density. *For more details, please download the PDF (catalog) or feel free to contact us.*
basic information
【Features】 ■ Fully automated formation of porous silicon. ■ Enables cassette-to-cassette operation without the use of back protection jigs. ■ Compatible with both N-type and P-type. ■ Supports various sizes from 2 to 6 inches. Please consult for sizes over 8 inches. As a nano-silicon technology, it expands possibilities for new application development in the fields of biomedical, secondary batteries, solar cells, and semiconductor processes. * Please consult regarding the diameter of the pores and the thickness of the porous silicon layer.
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Applications/Examples of results
Semiconductor manufacturing processes, electronic materials manufacturing processes, etc.
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