Wafer cleaning device (spin type) *Testable models available
Supports multiple chambers according to production scale. Achieves uniform etching of wafers.
Automatic Acid and Alkali Cleaning Device Compatible Work Sizes: φ2 to 12 inches. Please consult us for special sizes such as square substrates. The cleaning process is achieved by directly using two types of concentrated solutions through a two-fluid mixing nozzle. By adjusting the mixing ratio, it is possible to raise the temperature to the desired level using the reaction heat. 【Other Features】 ■ Capable of manufacturing devices with brush cleaning functions ■ Capable of manufacturing photo mask cleaning devices ■ Chemical supply and recovery unit can be integrated into the main device ■ Ozone water cleaning available as an option ■ Nanobubble cleaning available as an option You can conduct tests at our Tokyo Test Center. (Online support available) *For more details, please download the PDF (catalog) or feel free to contact us.
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For more details, please download the PDF (catalog) or feel free to contact us.
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Applications/Examples of results
Semiconductor manufacturing process, electronic materials manufacturing process, etc.
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