Magnetron sputtering device | Solving film thickness unevenness and rework of multilayer films
From research and development to prototyping! It allows for options from dual to quad configurations and simultaneous three-way discharge, with flexible support for future expansions such as load lock additions.
The magnetron sputtering device is a vacuum deposition system that prevents film thickness variation and film rework that occur in prototype lines for electronic devices and optical thin films. "Development is stalled due to atmospheric exposure and variations in deposition for each target..." To address such issues in experimental and prototyping environments, it provides a homogeneous film quality through a unique cathode and precise rotary and orbital mechanism. 【Recommended for the following concerns】 ◆ Variations in film thickness and quality on the work surface ◆ The hassle of breaking vacuum every time for multilayer film deposition ◆ Concerns about deposition defects or contamination due to oil contamination <Reasons for being chosen> - Maintains excellent film thickness uniformity through rotary and orbital mechanisms and substrate heating - Supports up to four-element cathodes and simultaneous three-element sputtering discharge - High expandability with oil-free exhaust and load-lock expansion compatibility *For any questions regarding cathode configuration or substrate heating temperature, please download the catalog or feel free to contact us. (We can also accommodate specifications discussions and custom design consultations.)
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The necessity of thin film production in next-generation technologies is increasing more and more. In thin film production, there is a demand for technology that is low-temperature, dense, and also highly productive. Our company has made it possible to implement arc discharge measures that were not achievable with conventional opposing target sputtering methods, and we manufacture and sell uniform plasma sputtering devices that meet the above conditions.