Low Oxygen Clean Oven for Substrates and Panels 'PVHC-31S'
A new model that meets the thermal processing needs of the expanding advanced semiconductor packaging field!
The "PVHC-31S" is a heat treatment solution designed to accommodate large workpieces and more precise heat treatment environments. Its unique structure, which places the cooling water flow path outside the furnace, eliminates dust sources within the furnace and ensures high temperature distribution performance through an efficient cooling mechanism and a simple air conditioning structure. Rapid cooling while maintaining a low-oxygen atmosphere contributes to quality assurance and reduced process time. 【Features】 ■ Supports heat treatment of large panel-shaped workpieces in the 600×600mm class ■ Achieves both low-oxygen atmosphere and high cleanliness, providing a stable process environment ■ Realizes safe and clean cooling capabilities by placing the water cooler outside the furnace ■ Compatible with automatic transport, process data management, and centralized equipment management ■ Allows for system configurations tailored to applications, including automatic doors and various interfaces and upper-level communication specifications *For more details, please download the PDF or feel free to contact us.
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【Specifications】 ■Internal dimensions: W800×H600×D800mm ■Temperature range: +70℃ to +300℃ ■Temperature rise and fall time: 80℃→300℃/60 minutes, 300℃→80℃/90 minutes ■Residual oxygen concentration: 100ppm or less ■Cleanliness: Class 5 (when temperature is stable) ■Options: Automatic door support, upper-level communication support, GEM communication support, EFEM linkage support *Detailed specifications will be discussed separately. *For more information, please download the PDF or feel free to contact us.
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