[Technical Information] Information on the assembly and bonding of multi-emitter modules is now available for free!
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In applications such as cutting, welding, and marking, fiber laser solutions are increasingly replacing traditional methods. In recent years, the manufacturing costs of semiconductor laser chips have been continuously reduced, but the current single largest cost factor is in assembly and packaging, primarily due to the manual processes involved in second-level packaging where the CoS is attached to the heat sink. To address this issue, Finetech has developed, evaluated, and provided an automated solution for packaging CoS to heat sinks using new bonding technology. This technical paper will explain this.
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