Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all those who visited us. We look forward to your continued support. ------------------------------------------------- At the Nepco Japan Autumn / Electronics Development and Implementation Exhibition, we will be showcasing our die bonding equipment at our booth. ■■■ Live Demonstration of FINE PLACER lambda2 ■■■ We will be exhibiting the compact tabletop die bonder/flip chip bonder lambda2. Fine Tech offers a wide range of products, from manual models to semi-automatic and fully automatic models. We will introduce high-precision implementation methods and the latest applications for various electronic devices, optical transmission and reception devices, MEMS, and micro components. We apologize for the inconvenience, but if you have time, please feel free to stop by.

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. ------------------------------------------------- We would like to express our sincere gratitude for your exceptional support. Fine Tech Japan will be exhibiting at NEPCON Japan 2022 (Autumn). On that day, we will be showcasing a live demonstration of the high-precision die bonder lambda2. We will also be introducing other models and addressing any questions related to various die bonding techniques, so we sincerely look forward to your visit. Venue and Booth Number: Makuhari Messe, Hall 2 & 3, A5-30 Dates: August 31, 2022 (Wednesday) to September 2, 2022 (Friday) Time: 10:00 AM to 5:00 PM

Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all of you who attended. We look forward to your continued support. Thank you very much for your exceptional patronage. Fine Tech Japan will be exhibiting at Nepcon Japan 2023. On the day of the event, we will be showcasing a live demonstration of the high-precision die bonder lambda2. We will also be introducing other models and addressing various questions related to die bonding, so we sincerely look forward to your visit.

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude and extend my sincere thanks to everyone who attended.

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. We would like to extend our sincere appreciation for your exceptional support. Fine Tech Japan will be exhibiting at NEPCON Japan 2023. On the day of the event, we will showcase a live demonstration of the high-precision die bonder lambda2. We will also be available to introduce other models and answer any questions regarding various die bonding processes, so we sincerely look forward to your visit. Exhibition Name: 37th NEPCON Japan [Electronics Development & Manufacturing Show] Dates: January 25 [Wed] - January 27 [Fri], 2023, 10:00 - 17:00 Venue: Tokyo Big Sight Booth Number: East Hall 3, 26-28

Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all those who visited us. We look forward to your continued support. At the Nepco Japan Autumn / Electronics Development and Implementation Exhibition, we will be showcasing our die bonding equipment at our booth. ★Demo Equipment Display★ We will exhibit the compact tabletop model, designed for prototype research purposes, the die bonder, and the flip chip bonder, lambda2. Faintech offers a wide range of products, from manual models to semi-automatic and fully automatic models. We will introduce high-precision implementation methods and the latest applications for various electronic devices, optical transmission and reception devices, MEMS, and micro components. We apologize for the inconvenience, but if you have time, please feel free to stop by.

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. ------------------------------------------------------------------------------------ Exhibition Participation Announcement (NEPCON Japan 2022 @ Tokyo Big Sight) We would like to express our sincere gratitude for your continued support. Fine Tech Japan will be participating in NEPCON Japan 2022, which will be held from January 19. On that day, we will showcase a live demonstration of the high-precision die bonder lambda2. We will also be available to introduce other models and answer any questions regarding various die bonding techniques, so we sincerely look forward to your visit. NEPCON Japan 2022 Semiconductor and Sensor Packaging Technology Exhibition Dates: January 19 (Wed) - 21 (Fri), 2022 Venue: Tokyo Big Sight, East Hall 3, Booth No. 26-45

This technical paper provides an explanation of the fully automated implementation process for high-output laser diodes, including general process parameters, bonding conditions, and process steps. It particularly introduces solutions to typical challenges faced during laser diode manufacturing, such as the bonding quality of Au80Sn20 and the various factors arising from the bonding process, materials, and the components themselves. We hope you find it helpful!

In the assembly (mounting and bonding) of optical package products, it is necessary to align optical components and electronic components with the highest precision. Furthermore, in cases such as products that incorporate thermoelectric coolers (TECs), the assembly process becomes even more complex. This technical paper explains the assembly of general printed circuit board (PCB) based optical transceiver modules (40 Gbit/s to 400 Gbit/s) for data communication applications, specifically QSFP (Quad Small Form-factor Pluggable). We hope you find it helpful!

In today's world, it is unimaginable to think of a scenario without technologies like Flex-on-Glass, which electrically connects flexible printed circuit boards to glass substrates, or Chip-on-Glass, which directly bonds chips to glass. These technologies utilize anisotropic conductive films and pastes that have different functional principles compared to conventional adhesives and solder materials, requiring appropriate processing. This technical paper introduces these technologies and discusses typical challenges and proven solutions. We hope you find it helpful!

Fine Tech's laser-assisted die bonding technology is suitable for chip-to-substrate (C2S) and chip-to-wafer (C2W) applications that require precise control of process speed, accuracy, and localized heating. In particular, rapid temperature cycling minimizes the risk of surface oxidation and enables the shortening of process cycles in production environments where temporal optimization is required. In continuous bonding processes at the substrate or wafer level, each chip is heated only once. Additionally, unlike area heating, localized laser heating does not require extensive equipment to prevent thermal expansion. Laser-assisted die bonding, with such features, is an effective technology newly added to Fine Tech's assembly and packaging technology.

Thermal compression bonding is a quick and easy method for reliably joining flip chips. Many bonding processes, such as eutectic soldering implemented with load in laser bar soldering, are fundamentally classified in this category. This technical paper focuses on specific thermal compression processes used in combination with gold stud bumps or indium bumps. Flip chip bonding using this bonding method has many advantages and possesses excellent bonding characteristics. Nevertheless, as this document shows, it is still a niche technology and not widespread. Here, we provide a general overview of the process and its parameters. We also address common challenges when adopting this technology and introduce methods to solve them using the FINEPLACER die bonding equipment.

The packaging of optoelectronics (optoelectronic components) units is one of the important applications in microassembly. In the recent field of photonics, multiplex transmitters and receivers with high-density packages targeting high bandwidth, as well as assemblies that combine them, have become crucial elements. Consequently, high placement accuracy is required for the bonding of these components, and various assembly technologies are utilized. This technical paper discusses these challenges and Fine Tech's solutions regarding the assembly of VCSELs and photodiodes, as well as relative high-precision bonding for single components and array components, handling of small components, safe transfer of adhesives, and advanced tool design for components with prohibited contact areas.

In applications such as cutting, welding, and marking, fiber laser solutions are increasingly replacing traditional methods. In recent years, the manufacturing costs of semiconductor laser chips have been continuously reduced, but the current single largest cost factor is in assembly and packaging, primarily due to the manual processes involved in second-level packaging where the CoS is attached to the heat sink. To address this issue, Finetech has developed, evaluated, and provided an automated solution for packaging CoS to heat sinks using new bonding technology. This technical paper will explain this.

This explains the challenges related to the assembly of laser diode bars, common error cases, and Fintech's approach as a solution to ensure the success of the process. Please make use of it!

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude and extend my sincere thanks to everyone who attended.

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude and extend my sincere thanks to everyone who attended.

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who attended.