[Technical Information] Information on thermal pressing bonding has been made available for free!
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Thermal compression bonding is a quick and easy method for reliably joining flip chips. Many bonding processes, such as eutectic soldering implemented with load in laser bar soldering, are fundamentally classified in this category. This technical paper focuses on specific thermal compression processes used in combination with gold stud bumps or indium bumps. Flip chip bonding using this bonding method has many advantages and possesses excellent bonding characteristics. Nevertheless, as this document shows, it is still a niche technology and not widespread. Here, we provide a general overview of the process and its parameters. We also address common challenges when adopting this technology and introduce methods to solve them using the FINEPLACER die bonding equipment.
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