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Products/Services
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FINEPLACER lambda2(13)
We handle the submicron-compatible, high-precision die bonding device 'FINEPLACER lambda'.
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FINEPLACER sigma(15)
We handle the 'FINEPLACER sigma', which achieves high precision, multipurpose functionality, and extensive expandability.
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FINEPLACER pico2(11)
We handle the multipurpose die bonding device "FINEPLACER pico2."
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FINEPLACER femto2(14)
We handle the fully automatic high-precision die bonding machine / mass production and prototype compatible machine 'FINEPLACER femto 2'.
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FINEPLACER femto(blu)(9)
The FINEPLACER(R) series model name femto(blu) is a high-precision die bonding machine with an implementation accuracy of 2.0 µm@3σ, ultra-low load control, fully automated operation, and compatibility with fine chips.
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Dai Bonder(15)
Here is an introduction to "Daibonder."
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Flip chip bonder(14)
Introducing the "Flip Chip Bonder."
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R&D and small-scale production applications(11)
This is an introduction to models suitable for "R&D and small-scale production."
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Full auto model(12)
This is an introduction to "models compatible with full auto."
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Semi-automatic model(12)
This is an introduction to the "semi-automatic type" model.
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Manual model(12)
This is an introduction to the "manual operation type" model.
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Small tabletop model(12)
Here is an introduction to the "desktop type."
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Independent enclosure model(12)
Introducing the "Independent Enclosure Type."
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Ultra-high precision (<0.5μm)(13)
This is an introduction to models compatible with a mounting accuracy of ≤0.5μm.
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High precision (>0.5μm)(12)
This is an introduction to models compatible with a mounting accuracy of greater than 0.5μm.
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Technical document presentation in progress.(14)
This is an introduction to our technical documentation.
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【Usage Example】Presentation of Materials in Progress(9)
Here is an introduction to our use cases.
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Customer case materials being presented.(11)
We will introduce our case study.
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【 Technical Blog 】(11)
We would like to introduce our blog.