High-precision die bonder and flip chip bonder 'lambda2'
High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.
Lambda2 is a new standard model of high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact desktop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies, including thermal compression, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact desktop size, it offers a very user-friendly scale for equipment installation, and with future expandability through a modular system, it represents a highly cost-effective model. Lambda2 is a new standard model from Fine Tech, a German manufacturer specializing in die bonders, which has poured its unique know-how into it. The ultra-high precision and usability achieved through its unique design philosophy are unmatched by other manufacturers. For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Main Specifications】 ○ Mounting Accuracy: 0.5μm ○ Optical Field of View Range: 0.54mm×0.43mm (minimum), 6.6mm×5.28mm (maximum) ○ θ Fine Adjustment Range: ±15° ○ Z Height Adjustment Range: 10mm ○ Working Area: 190mm×52mm ○ Load Range: 0.1N to 400N ○ Maximum Heating Temperature: 450℃ ○ Device Size: 660mm×610mm×640mm (main unit) ○ Compatible with formic acid gas processes *For more details, please refer to the catalog or feel free to contact us.
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【Features】 ○ Compatible chip size: 0.03mm - 20mm ○ Compatible substrate size: up to 150mm ○ Overlay display of die, chip, and mounting substrate (patented) ○ Closed-loop load control ○ Programmable optical shift function: up to 40mm ○ Compatible with formic acid gas processes *For more details, please refer to the catalog or feel free to contact us.
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Thank you for attending: IEEE 3DIC@Sendai 9/25-9/27
Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. We are honored to have the opportunity to exhibit at the IEEE International 3D Systems Integration Conference (3DIC). We hope to engage with many guests while participating in this platform for presenting cutting-edge technologies related to semiconductor processes.
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Thank you for attending: Nepco Japan 2024 Autumn @ Makuhari Messe, September 4-6.
Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all those who visited us. We look forward to your continued support. ------------------------------------------------- At the Nepco Japan Autumn / Electronics Development and Implementation Exhibition, we will be showcasing our die bonding equipment at our booth. ■■■ Live Demonstration of FINE PLACER lambda2 ■■■ We will be exhibiting the compact tabletop die bonder/flip chip bonder lambda2. Fine Tech offers a wide range of products, from manual models to semi-automatic and fully automatic models. We will introduce high-precision implementation methods and the latest applications for various electronic devices, optical transmission and reception devices, MEMS, and micro components. We apologize for the inconvenience, but if you have time, please feel free to stop by.
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Thank you for attending: Nepcon Japan 2022 Autumn @ Makuhari Messe
Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. ------------------------------------------------- We would like to express our sincere gratitude for your exceptional support. Fine Tech Japan will be exhibiting at NEPCON Japan 2022 (Autumn). On that day, we will be showcasing a live demonstration of the high-precision die bonder lambda2. We will also be introducing other models and addressing any questions related to various die bonding techniques, so we sincerely look forward to your visit. Venue and Booth Number: Makuhari Messe, Hall 2 & 3, A5-30 Dates: August 31, 2022 (Wednesday) to September 2, 2022 (Friday) Time: 10:00 AM to 5:00 PM
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Thank you for attending: NEPCON Japan 2024 @ Tokyo Big Sight
Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all of you who attended. We look forward to your continued support. Thank you very much for your exceptional patronage. Fine Tech Japan will be exhibiting at Nepcon Japan 2023. On the day of the event, we will be showcasing a live demonstration of the high-precision die bonder lambda2. We will also be introducing other models and addressing various questions related to die bonding, so we sincerely look forward to your visit.
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Thank you for attending: Nepcon Japan 2020 @ Tokyo Big Sight
Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude and extend my sincere thanks to everyone who attended.
