High precision (>0.5μm)

High precision (>0.5μm)
This is an introduction to models compatible with a mounting accuracy of greater than 0.5μm.
1~12 item / All 12 items
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Multipurpose Die Bonder / Flip Chip Bonder "pico 2"
Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.
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Full Auto Flip Chip Bonder: femto blu
The FINEPLACER femto blu is a new model of a fully automatic flip chip bonder/die bonder that balances productivity and precision.
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Technical Data: Flip Chip Bonding to Organic Substrates
Description of the characteristic evaluation of micro-implementation technology! It includes experimental results and discussions.
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Technical Data: Bonding Technology for 3D Packaging
Evaluation Report on 3D Packaging Technology Using the High-Precision Die Bonding Device "FINEPLACER sigma"
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Technical Data: Laser Bonding
This document contains technical information about laser bar bonding!
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Technical Data: Bonding Using Anisotropic Conductive Adhesive
This document contains technical information regarding bonding using anisotropic conductive adhesives!
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Technical Data: Optical Package Assembly
Detailed information on the assembly and bonding of optical packages (optical package products) is provided.
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Technical Data: Multi-Emitter Module Assembly
Detailed information on the assembly and bonding of multi-emitter modules.
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Technical Data: Laser-Assisted Die Bonding
Detailed information on laser-assisted die bonding.
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Technical Data: Assembly of VCSEL and Photodiode
Detailed information on the assembly of VCSELs and photodiodes.
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Technical Data: Heat Press Bonding
Detailed information on hot pressing bonding.
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Technical Data: Fully Automated Implementation of High-Power Laser Diodes
Detailed information on fully automated implementation of high-output laser diodes.
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