Technical Data: Assembly of VCSEL and Photodiode
Detailed information on the assembly of VCSELs and photodiodes.
The packaging of optoelectronics (photoelectronic components) units is one of the important applications in microassembly. In the recent field of photonics, multiplex transmitters and receivers with high-density packaging targeting high bandwidth, as well as assemblies that combine them, have become crucial elements. Consequently, high placement accuracy is required for the bonding of these components, and various assembly technologies are utilized. This technical paper discusses the challenges associated with these components and Fine Tech's solutions for the assembly of VCSELs and photodiodes, as well as relative high-precision bonding for single components and array components, handling of small components, safe transfer of adhesives, and advanced tool design for components with contact prohibition areas. *For more details, please refer to the PDF document or feel free to contact us.*
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