High-precision flip chip bonder: lambda2

The FINEPLACER lambda 2 is a new standard model for high-precision die bonders and flip chip bonders.

最終更新日 Jan 26, 2024

Multipurpose Die Bonder / Flip Chip Bonder "pico 2"

Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

最終更新日 Jul 29, 2024

High-precision die bonder/flip chip bonder 'sigma'

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

最終更新日 Jul 29, 2024

Technical Data: Flip Chip Bonding to Organic Substrates

Description of the characteristic evaluation of micro-implementation technology! It includes experimental results and discussions.

最終更新日 May 28, 2020

Technical Data: Bonding Technology for 3D Packaging

Evaluation Report on 3D Packaging Technology Using the High-Precision Die Bonding Device "FINEPLACER sigma"

最終更新日 May 28, 2020

Technical Data: Laser Bonding

This document contains technical information about laser bar bonding!

最終更新日 Jul 28, 2021

Technical Data: Bonding Using Anisotropic Conductive Adhesive

This document contains technical information regarding bonding using anisotropic conductive adhesives!

最終更新日 Aug 06, 2021

Technical Data: Optical Package Assembly

Detailed information on the assembly and bonding of optical packages (optical package products) is provided.

最終更新日 Aug 06, 2021

Technical Data: Multi-Emitter Module Assembly

Detailed information on the assembly and bonding of multi-emitter modules.

最終更新日 Nov 01, 2021

Technical Data: Laser-Assisted Die Bonding

Detailed information on laser-assisted die bonding.

最終更新日 Nov 01, 2021

Technical Data: Assembly of VCSEL and Photodiode

Detailed information on the assembly of VCSELs and photodiodes.

最終更新日 Nov 01, 2021

Technical Data: Heat Press Bonding

Detailed information on hot pressing bonding.

最終更新日 Nov 01, 2021