Manual model
Manual model
This is an introduction to the "manual operation type" model.
1～12 item / All 12 items
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High-precision flip chip bonder: lambda2
The FINEPLACER lambda 2 is a new standard model for high-precision die bonders and flip chip bonders.
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Multipurpose Die Bonder / Flip Chip Bonder "pico 2"
Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.
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High-precision die bonder/flip chip bonder 'sigma'
The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.
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Technical Data: Flip Chip Bonding to Organic Substrates
Description of the characteristic evaluation of micro-implementation technology! It includes experimental results and discussions.
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Technical Data: Bonding Technology for 3D Packaging
Evaluation Report on 3D Packaging Technology Using the High-Precision Die Bonding Device "FINEPLACER sigma"
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Technical Data: Laser Bonding
This document contains technical information about laser bar bonding!
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Technical Data: Bonding Using Anisotropic Conductive Adhesive
This document contains technical information regarding bonding using anisotropic conductive adhesives!
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Technical Data: Optical Package Assembly
Detailed information on the assembly and bonding of optical packages (optical package products) is provided.
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Technical Data: Multi-Emitter Module Assembly
Detailed information on the assembly and bonding of multi-emitter modules.
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Technical Data: Laser-Assisted Die Bonding
Detailed information on laser-assisted die bonding.
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Technical Data: Assembly of VCSEL and Photodiode
Detailed information on the assembly of VCSELs and photodiodes.
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Technical Data: Heat Press Bonding
Detailed information on hot pressing bonding.
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