Technical Data: Laser Bonding
This document contains technical information about laser bar bonding!
The semiconductor laser diode bar is used as an excitation light source for optical resonators in solid-state lasers and gas lasers, as well as in other fields such as medical devices and material processing. In the assembly process, alignment and bonding to the sub-carrier, as well as bonding to special heat sinks for sub-assemblies, are performed. This document describes the challenges related to the assembly of laser diode bars, common error cases, and Fine Tech's approach as a solution to ensure the success of the process. *For more details, please refer to the PDF document or feel free to contact us.*
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Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.