Technical Data: Laser Bonding
This document contains technical information about laser bar bonding!
The semiconductor laser diode bar is used as an excitation light source for optical resonators in solid-state lasers and gas lasers, as well as in other fields such as medical devices and material processing. In the assembly process, alignment and bonding to the sub-carrier, as well as bonding to special heat sinks for sub-assemblies, are performed. This document describes the challenges related to the assembly of laser diode bars, common error cases, and Fine Tech's approach as a solution to ensure the success of the process. *For more details, please refer to the PDF document or feel free to contact us.*
basic information
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