Technical Data: Laser-Assisted Die Bonding
Detailed information on laser-assisted die bonding.
Fine Tech's laser-assisted die bonding technology is suitable for chip-to-substrate (C2S) and chip-to-wafer (C2W) applications that require precise control of process speed, accuracy, and localized heating. In particular, rapid temperature cycling minimizes the risk of surface oxidation and enables the shortening of process cycles in production environments where temporal optimization is required. In continuous bonding processes at the substrate or wafer level, each chip is heated only once. Additionally, unlike area heating, localized laser heating does not require extensive equipment to prevent thermal expansion. Laser-assisted die bonding with such features is an effective technology newly added to Fine Tech's assembly and packaging technology. *For more details, please refer to the PDF document or feel free to contact us.*
basic information
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