Technical Data: Bonding Using Anisotropic Conductive Adhesive
This document contains technical information regarding bonding using anisotropic conductive adhesives!
It is now unimaginable to have a world without technologies like Flex-on-Glass, which electrically connects flexible printed circuit boards to glass substrates, or Chip-on-Glass, which directly bonds chips to glass. These technologies utilize anisotropic conductive films and pastes that have different functional principles compared to conventional adhesives and solder materials, requiring appropriate processing. This technical paper introduces these technologies and discusses typical challenges and proven solutions. *For more details, please refer to the PDF document or feel free to contact us.*
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Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.