Technical Data: Bonding Using Anisotropic Conductive Adhesive
This document contains technical information regarding bonding using anisotropic conductive adhesives!
It is now unimaginable to have a world without technologies like Flex-on-Glass, which electrically connects flexible printed circuit boards to glass substrates, or Chip-on-Glass, which directly bonds chips to glass. These technologies utilize anisotropic conductive films and pastes that have different functional principles compared to conventional adhesives and solder materials, requiring appropriate processing. This technical paper introduces these technologies and discusses typical challenges and proven solutions. *For more details, please refer to the PDF document or feel free to contact us.*
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