Multipurpose Die Bonder / Flip Chip Bonder "pico 2"

Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

The "pico 2" is a multipurpose die bonder with a mounting accuracy within 3μm. With quick setup and easy operation, it is suitable for rapid and flexible product development and prototyping in corporate laboratories and universities. Additionally, thanks to its modular design philosophy, new functions can be added even after the equipment has been installed, allowing for easy integration throughout the equipment's lifespan. 【Features】 ■ Compact tabletop die bonder ideal for prototyping and research and development ■ Simple operation for alignment using a unique vision alignment system ■ Supports various mounting processes such as thermocompression, soldering, ultrasonic, and adhesive ■ Integrated process control (heat, temperature, load, etc.) via IPM commands ■ Accommodates a wide range of component sizes (0.05mm to 100mm) ■ Cost-effective equipment configuration through a modular system *For more details, please refer to the PDF document or feel free to contact us.

basic information

【Other Features】 ■ Observation of running processes ■ Access to all processes and easy visual programming via touchscreen operation ■ Individual configuration through process modules ■ Device variations with options for full auto or semi-auto ■ Wide bonding area *For more details, please refer to the PDF document or feel free to contact us.