Technical Data: Bonding Technology for 3D Packaging
Evaluation Report on 3D Packaging Technology Using the High-Precision Die Bonding Device "FINEPLACER sigma"
This document introduces various bonding methods used in 3D packaging. As a result of extensive prototype research, various chips with a high number of bumps (up to 143,000), narrow pitch widths (minimum 25μm), and small bump diameters (minimum 13μm) were mounted on substrates using the high-precision die bonder "FINEPLACER sigma." It presents experimental methods related to 3D packaging technology, the process parameters used, and the results obtained. [Contents (excerpt)] ■ Metal diffusion (MD) bonding, transient liquid phase bonding (TLPB) ■ Thermal compression bonding using pre-underfill ■ Liquid-solid diffusion bonding (SLID) ■ Thermal compression bonding ■ Eutectic bonding ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.
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