High-precision die bonder/flip chip bonder 'sigma'
The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.
The model name sigma of the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N in a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, accommodating MEMS/MOEMS assembly, bonding of image sensors, and chip packaging at the wafer level. FINEPLACER sigma is a model designed for development applications that support assembly technologies aimed at the future, catering to a variety of technologies and applications.
basic information
【Main Specifications】 ○ Mounting Accuracy: ±0.5μm ○ Optical Field of View Range: 3.8mm (expanded 83mm) x 2.7mm ○ Optical Field of View Resolution: 1μm/pix ○ Compatible Chip Size: 0.1mm x 0.1mm to 80mm x 100mm ○ Maximum Compatible Substrate Size: 300mm x 300mm ○ θ Adjustment Range: ±15° (±2° fine adjustment) ○ Z Height Adjustment Range: 10mm ○ Working Area: 440mm x 150mm ○ Maximum Bonding Load: 1000N ○ Maximum Heating Temperature: 450℃ ○ Compatible with Vacuum Chamber Process ● For more details, please contact us or download the catalog.
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Applications/Examples of results
【Features】 ○ Implementation with sub-micron accuracy within a 300mm substrate size area ○ Achieves maximum optical resolution at all magnifications ○ Bonding load control up to 1000N ○ Alignment position verification using digital pattern recognition ○ Intuitive operation using a touchscreen panel ○ Modular system design allows for diverse configurations ○ Compatible with vacuum vacuum chamber processes ● For more details, please contact us or download the catalog.
Detailed information
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catalog(10)
Download All CatalogsNews about this product(7)
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Thank you for attending: IEEE 3DIC@Sendai 9/25-9/27
Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. We are honored to have the opportunity to exhibit at the IEEE International 3D Systems Integration Conference (3DIC). We hope to engage with many guests while participating in this platform for presenting cutting-edge technologies related to semiconductor processes.
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Thank you for attending: Nepco Japan 2024 Autumn @ Makuhari Messe, September 4-6.
Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all those who visited us. We look forward to your continued support. ------------------------------------------------- At the Nepco Japan Autumn / Electronics Development and Implementation Exhibition, we will be showcasing our die bonding equipment at our booth. ■■■ Live Demonstration of FINE PLACER lambda2 ■■■ We will be exhibiting the compact tabletop die bonder/flip chip bonder lambda2. Fine Tech offers a wide range of products, from manual models to semi-automatic and fully automatic models. We will introduce high-precision implementation methods and the latest applications for various electronic devices, optical transmission and reception devices, MEMS, and micro components. We apologize for the inconvenience, but if you have time, please feel free to stop by.
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Thank you for attending: Nepcon Japan 2020 @ Tokyo Big Sight
Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude and extend my sincere thanks to everyone who attended.
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Thank you for attending: Nepcon Japan 2023 Autumn @ Makuhari Messe
Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all those who visited us. We look forward to your continued support. At the Nepco Japan Autumn / Electronics Development and Implementation Exhibition, we will be showcasing our die bonding equipment at our booth. ★Demo Equipment Display★ We will exhibit the compact tabletop model, designed for prototype research purposes, the die bonder, and the flip chip bonder, lambda2. Faintech offers a wide range of products, from manual models to semi-automatic and fully automatic models. We will introduce high-precision implementation methods and the latest applications for various electronic devices, optical transmission and reception devices, MEMS, and micro components. We apologize for the inconvenience, but if you have time, please feel free to stop by.
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Thank you for attending: Nepcon Japan 2022 @ Tokyo Big Sight
Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. ------------------------------------------------------------------------------------ Exhibition Participation Announcement (NEPCON Japan 2022 @ Tokyo Big Sight) We would like to express our sincere gratitude for your continued support. Fine Tech Japan will be participating in NEPCON Japan 2022, which will be held from January 19. On that day, we will showcase a live demonstration of the high-precision die bonder lambda2. We will also be available to introduce other models and answer any questions regarding various die bonding techniques, so we sincerely look forward to your visit. NEPCON Japan 2022 Semiconductor and Sensor Packaging Technology Exhibition Dates: January 19 (Wed) - 21 (Fri), 2022 Venue: Tokyo Big Sight, East Hall 3, Booth No. 26-45
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Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.