Multipurpose Die Bonder / Flip Chip Bonder "pico 2"

Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

last updated Jul 29, 2024

Technical Data: Flip Chip Bonding to Organic Substrates

Description of the characteristic evaluation of micro-implementation technology! It includes experimental results and discussions.

last updated May 28, 2020

Technical Data: Laser Bonding

This document contains technical information about laser bar bonding!

last updated Jul 28, 2021

Technical Data: Bonding Using Anisotropic Conductive Adhesive

This document contains technical information regarding bonding using anisotropic conductive adhesives!

last updated Aug 06, 2021

Technical Data: Optical Package Assembly

Detailed information on the assembly and bonding of optical packages (optical package products) is provided.

last updated Aug 06, 2021

Technical Data: Multi-Emitter Module Assembly

Detailed information on the assembly and bonding of multi-emitter modules.

last updated Nov 01, 2021

Technical Data: Laser-Assisted Die Bonding

Detailed information on laser-assisted die bonding.

last updated Nov 01, 2021

Technical Data: Assembly of VCSEL and Photodiode

Detailed information on the assembly of VCSELs and photodiodes.

last updated Nov 01, 2021

Technical Data: Heat Press Bonding

Detailed information on hot pressing bonding.

last updated Nov 01, 2021

[Use Case] Implementation and Packaging of Optical Communication Devices

From prototype development to mass production! Ensuring high yield with manufacturing technology.

last updated Jul 01, 2021

[Use Case] High-precision assembly due to high optical resolution

Achieved an optical resolution of 0.7µm!

last updated Jul 01, 2021