[Use Case] High-precision assembly due to high optical resolution
Achieved an optical resolution of 0.7µm!
In the implementation of optical devices such as VCSELs and PDs, the alignment target is an aperture with a diameter of only 7 micrometers. Achieving high-precision alignment of this within a millimeter-scale field of view is extremely challenging.
basic information
【Fine Tech's Solutions】 ○ High-precision die bonding requires accurate magnification and resolution. If either is lacking, achieving sub-micron implementation becomes impossible. ○ If only high magnification is achieved, the alignment image will be a blurred (magnified noise signal) image, and reproducibility will not be maintained. ○ Conversely, with low magnification and high resolution, the alignment image will be very small, making high-precision implementation nearly impossible. ○ Fine Tech's die bonders utilize top-quality optical technology with precise magnification and advanced resolution, providing sharp alignment images necessary to achieve sub-micron accuracy.
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Applications/Examples of results
○FINEPLACER Series High-Precision Die Bonding Equipment The high-precision die bonding equipment of the FINEPLACER series flexibly accommodates various mounting applications through the adoption of a modular system.
