High-precision full-auto flip chip bonder: femto2

The FINEPLACER femto2 is a high-precision, high-performance fully automatic flip chip bonder/die bonder designed for cutting-edge applications.

last updated Aug 18, 2021

Full Auto Flip Chip Bonder: femto blu

The FINEPLACER femto blu is a new model of a fully automatic flip chip bonder/die bonder that balances productivity and precision.

last updated Aug 18, 2021

Technical Data: Fully Automated Implementation of High-Power Laser Diodes

Detailed information on fully automated implementation of high-output laser diodes.

last updated Dec 16, 2021

Technical Data: Flip Chip Bonding to Organic Substrates

Description of the characteristic evaluation of micro-implementation technology! It includes experimental results and discussions.

last updated May 28, 2020

Technical Data: Bonding Technology for 3D Packaging

Evaluation Report on 3D Packaging Technology Using the High-Precision Die Bonding Device "FINEPLACER sigma"

last updated May 28, 2020

Technical Data: Laser Bonding

This document contains technical information about laser bar bonding!

last updated Jul 28, 2021

Technical Data: Bonding Using Anisotropic Conductive Adhesive

This document contains technical information regarding bonding using anisotropic conductive adhesives!

last updated Aug 06, 2021

Technical Data: Optical Package Assembly

Detailed information on the assembly and bonding of optical packages (optical package products) is provided.

last updated Aug 06, 2021

Technical Data: Multi-Emitter Module Assembly

Detailed information on the assembly and bonding of multi-emitter modules.

last updated Nov 01, 2021

Technical Data: Laser-Assisted Die Bonding

Detailed information on laser-assisted die bonding.

last updated Nov 01, 2021

Technical Data: Assembly of VCSEL and Photodiode

Detailed information on the assembly of VCSELs and photodiodes.

last updated Nov 01, 2021

Technical Data: Heat Press Bonding

Detailed information on hot pressing bonding.

last updated Nov 01, 2021