High-precision full-auto flip chip bonder: femto2
The FINEPLACER femto2 is a high-precision, high-performance fully automatic flip chip bonder/die bonder designed for cutting-edge applications.
The model name femto2 of the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.5μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely isolates itself from external influences, achieving a stable assembly process with top-class yield. *For more details, please download the PDF or contact us.
basic information
【Main Specifications】 ○ Mounting Accuracy: ±0.5μm @ 3Sigma ○ Optical Field of View: 3.8mm x 2.7mm ○ Optical Field of View Resolution: 1μm/pix ○ Magnified Field of View: 103.8mm x 2.7mm ○ Compatible Chip Size (Minimum): 0.03mm x 0.03mm to 100mm x 100mm ○ θ Fine Adjustment: ±9°/ 3.5μrad ○ Z Movement / Accuracy: 10mm / 0.2μm ○ Y Movement / Accuracy: 150mm / 0.1μm ○ X Movement / Accuracy: 450mm / 0.1μm ○ Substrate Heating Temperature: 500℃ ○ Bonding Load Range: 0.05N to 1000N *For more details, please contact us or download the catalog.
Price information
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Delivery Time
Applications/Examples of results
【Features】 ○ Implementation accuracy of 0.5μm @ 3 sigma ○ Complete automation of various implementation processes ○ Manual operation routines available ○ Process environment managed with cleanroom quality ○ Operator safety protection (laser, UV sources, gases, etc.) ○ Access to all processes with immediate setup capability ○ Equipped with FPXvisionTM, achieving maximum optical resolution with a wide field of view ○ Intuitive operation using a touch screen panel ○ Modular system design allows for diverse configurations ● For more details, please contact us or download the catalog.
