【Usage Example】Presentation of Materials in Progress
【Usage Example】Presentation of Materials in Progress
Here is an introduction to our use cases.
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[Use Case] High-precision assembly due to high optical resolution
Achieved an optical resolution of 0.7µm!
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[Use Case] Implementation and Packaging of Optical Communication Devices
From prototype development to mass production! Ensuring high yield with manufacturing technology.
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[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly
Multiple processes with a single device! Bonding position accuracy of 0.5µm!
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[Application Example] 3D Mounting with High-Precision Die Bonder
Submicron positional accuracy! High bonding load up to 1000N!
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[Application Example] Implementation of VCSEL and PD using a high-precision die bonder.
Bonding position accuracy of 0.5µm!
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High-precision flip chip bonder: lambda2
The FINEPLACER lambda 2 is a new standard model for high-precision die bonders and flip chip bonders.
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High-precision, high-function flip chip bonder: sigma
The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.
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High-precision full-auto flip chip bonder: femto2
The FINEPLACER femto2 is a high-precision, high-performance fully automatic flip chip bonder/die bonder designed for cutting-edge applications.
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Full Auto Flip Chip Bonder: femto blu
The FINEPLACER femto blu is a new model of a fully automatic flip chip bonder/die bonder that balances productivity and precision.
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