[Application Example] 3D Mounting with High-Precision Die Bonder
Submicron positional accuracy! High bonding load up to 1000N!
In the development of electronic devices, there is a constant demand for increased speed, higher density, and optimization of device size and functional integration. Recent technological trends have made it a critical issue to incorporate three-dimensional stacked structures into the implementation of microprocessors, memory, image sensors, and IR sensors. In response to various demands such as the reduction of pitch size, the need for miniaturization of devices, and the pursuit of thermal and electrical mechanical stability, optimization of internal wiring is required. To accommodate the increasing number of bumps, miniaturization of pitch size, and demands for reduced device height, high-precision die bonders and flip chip bonders that guarantee large bonding loads and extensive flatness are needed.
basic information
**Fine Tech's Solutions** ○ 3D packaging technology using the high-precision die bonding equipment FINEPLACER sigma Fine Tech has achieved high-precision mounting of dies and chips composed of numerous bumps (up to 143,000), narrow pitch widths (down to 25 microns), and small bump diameters (down to 13 microns) using various processes related to 3D stacking technology. * Thermal compression bonding using pre-underfill * Solid Liquid Interdiffusion Bonding (SLID) * Thermal compression bonding (metal-to-metal) * Eutectic bonding
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○FINEPLACER Series High-Precision Die Bonding Equipment The FINEPLACER series high-precision die bonding equipment flexibly accommodates various mounting applications through the adoption of a modular system.
