Customer case materials being presented.
Customer case materials being presented.
We will introduce our case study.
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[Customer Case] Brain Implant Offers New Hope for Epilepsy Patients
Continuously monitor brain waves through embedded electrodes! Provide stimulation at precise timings.
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[Customer Case] Provides direction and important information at a glance!
Contributing to the maintenance of a timely flow of information.
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[Customer Case] High-Power Semiconductor Laser Assembly for Mars Rover
Investigating the geology and climate of Mars! Assembled with a precision die bonder made by Finetech.
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[Customer Case] Top-notch Equipment for Top-notch Research
It provides a foundation for critical thinking and scientific development for scholars and experts.
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[Customer Case] Die Bonder Supporting Stacking Implementation of Membrane Chips
We are stacking delicate membrane chips with a post-bonding accuracy of less than 1μm!
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[Customer Case] Utilization of High-Precision Die Bonder
We provide advanced research facilities for microsystem technology to our partners!
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[Customer Case] Innovative Radiation Detection Device Prototype Assembly to Mass Production
This is an introduction to a case where the assembly device was able to meet the conditions necessary for growth.
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High-precision flip chip bonder: lambda2
The FINEPLACER lambda 2 is a new standard model for high-precision die bonders and flip chip bonders.
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High-precision, high-function flip chip bonder: sigma
The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.
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High-precision full-auto flip chip bonder: femto2
The FINEPLACER femto2 is a high-precision, high-performance fully automatic flip chip bonder/die bonder designed for cutting-edge applications.
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Full Auto Flip Chip Bonder: femto blu
The FINEPLACER femto blu is a new model of a fully automatic flip chip bonder/die bonder that balances productivity and precision.
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