High-precision, high-function flip chip bonder: sigma
The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.
The model name sigma from the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N within a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, supporting wafer-level applications such as MEMS/MOEMS assembly, image sensor bonding, and chip packaging. The FINEPLACER sigma is designed for development applications that align with future-oriented assembly technologies, accommodating a variety of techniques and applications.
basic information
【Main Specifications】 ○ Mounting Accuracy: ±0.5μm ○ Optical Field of View Range: 3.8mm (expanded 83mm) x 2.7mm ○ Optical Field of View Resolution: 1μm/pix ○ Compatible Chip Size: 0.1mm x 0.1mm to 80mm x 100mm ○ Maximum Compatible Substrate Size: 300mm x 300mm ○ θ Adjustment Range: ±15° (±2° fine adjustment) ○ Z Height Adjustment Range: 10mm ○ Working Area: 440mm x 150mm ○ Maximum Bonding Load: 1000N ○ Maximum Heating Temperature: 450℃ ○ Compatible with Vacuum Chamber Process ● For more details, please contact us or download the catalog.
Price range
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Applications/Examples of results
【Features】 ○ Implementation with sub-micron precision within a 300mm substrate size area ○ Achieves maximum optical resolution at all magnifications ○ Bonding load control up to 1000N ○ Alignment position confirmation using digital pattern recognition ○ Intuitive operation using a touchscreen panel ○ Diverse configurations possible with modular system adoption ○ Compatible with vacuum vacuum chamber processes ● For more details, please contact us or download the catalog.
