High-precision die bonder and flip chip bonder 'lambda2'

High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

last updated Jul 29, 2024

High-precision die bonder/flip chip bonder 'sigma'

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

last updated Jul 29, 2024

High-precision flip chip bonder 'femto2'

Fully automatic high-precision die bonding machine

last updated Nov 10, 2024

High-precision die bonder femto blu with a mounting accuracy of 2.0μm@3σ.

This is a high-precision die bonding machine with ultra-low load control, fully automatic operation, and compatibility with fine chips. *Technical materials are also available!

last updated Jun 15, 2021

Technical Data: Fully Automated Implementation of High-Power Laser Diodes

Detailed information on fully automated implementation of high-output laser diodes.

last updated Dec 16, 2021

Technical Data: Flip Chip Bonding to Organic Substrates

Description of the characteristic evaluation of micro-implementation technology! It includes experimental results and discussions.

last updated May 28, 2020

Technical Data: Bonding Technology for 3D Packaging

Evaluation Report on 3D Packaging Technology Using the High-Precision Die Bonding Device "FINEPLACER sigma"

last updated May 28, 2020

Technical Data: Laser Bonding

This document contains technical information about laser bar bonding!

last updated Jul 28, 2021

Technical Data: Bonding Using Anisotropic Conductive Adhesive

This document contains technical information regarding bonding using anisotropic conductive adhesives!

last updated Aug 06, 2021

Technical Data: Optical Package Assembly

Detailed information on the assembly and bonding of optical packages (optical package products) is provided.

last updated Aug 06, 2021

Technical Data: Multi-Emitter Module Assembly

Detailed information on the assembly and bonding of multi-emitter modules.

last updated Nov 01, 2021

Technical Data: Laser-Assisted Die Bonding

Detailed information on laser-assisted die bonding.

last updated Nov 01, 2021

Technical Data: Assembly of VCSEL and Photodiode

Detailed information on the assembly of VCSELs and photodiodes.

last updated Nov 01, 2021

Technical Data: Heat Press Bonding

Detailed information on hot pressing bonding.

last updated Nov 01, 2021

Multipurpose Die Bonder / Flip Chip Bonder "pico 2"

Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

last updated Jul 29, 2024