High-precision flip chip bonder 'femto2'
Fully automatic high-precision die bonding machine
The model name femto2 from the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.3μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely shields against external influences, achieving a top-class yield and a stable assembly process. *For more details, please download the PDF or contact us.*
basic information
【Main Specifications】 ○ Mounting Accuracy: ±0.3μm @ 3Sigma ○ Optical Field of View: 3.8mm x 2.7mm ○ Optical Field of View Resolution: 1μm/pix ○ Supported Chip Size (Minimum): 0.03mm x 0.03mm to 100mm x 100mm ○ θ Fine Adjustment: ±9°/ 3.5μrad ○ Z Movement / Accuracy: 10mm / 0.2μm ○ Y Movement / Accuracy: 150mm / 0.02μm ○ X Movement / Accuracy: 660mm / 0.02μm ○ Substrate Heating Temperature: 500℃ ○ Bonding Load Range: 0.05N to 1000N *For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
**Features** - Implementation accuracy of 0.3μm@3sigma - Complete automation of various implementation processes - Manual operation routines available - Process environment managed with cleanroom quality - Operator safety protection (laser, UV sources, gases, etc.) - Access to all processes with immediate setup capability - Equipped with FPXvisionTM, achieving maximum optical resolution with a wide field of view - Intuitive operation using a touchscreen panel - Modular system design allows for diverse configurations For more details, please contact us or download the catalog.
Related Videos
catalog（10）
Download All Catalogs
News about this product（7）
-
Thank you for attending: IEEE 3DIC@Sendai 9/25-9/27
Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. We are honored to have the opportunity to exhibit at the IEEE International 3D Systems Integration Conference (3DIC). We hope to engage with many guests while participating in this platform for presenting cutting-edge technologies related to semiconductor processes.
-
Thank you for attending: Nepco Japan 2024 Autumn @ Makuhari Messe, September 4-6.
Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all those who visited us. We look forward to your continued support. ------------------------------------------------- At the Nepco Japan Autumn / Electronics Development and Implementation Exhibition, we will be showcasing our die bonding equipment at our booth. ■■■ Live Demonstration of FINE PLACER lambda2 ■■■ We will be exhibiting the compact tabletop die bonder/flip chip bonder lambda2. Fine Tech offers a wide range of products, from manual models to semi-automatic and fully automatic models. We will introduce high-precision implementation methods and the latest applications for various electronic devices, optical transmission and reception devices, MEMS, and micro components. We apologize for the inconvenience, but if you have time, please feel free to stop by.
-
Thank you for attending: Nepcon Japan 2020 @ Tokyo Big Sight
Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude and extend my sincere thanks to everyone who attended.
-
Thank you for attending: Nepcon Japan 2023 Autumn @ Makuhari Messe
Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all those who visited us. We look forward to your continued support. At the Nepco Japan Autumn / Electronics Development and Implementation Exhibition, we will be showcasing our die bonding equipment at our booth. ★Demo Equipment Display★ We will exhibit the compact tabletop model, designed for prototype research purposes, the die bonder, and the flip chip bonder, lambda2. Faintech offers a wide range of products, from manual models to semi-automatic and fully automatic models. We will introduce high-precision implementation methods and the latest applications for various electronic devices, optical transmission and reception devices, MEMS, and micro components. We apologize for the inconvenience, but if you have time, please feel free to stop by.
-
Thank you for attending: Nepcon Japan 2022 @ Tokyo Big Sight
Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. ------------------------------------------------------------------------------------ Exhibition Participation Announcement (NEPCON Japan 2022 @ Tokyo Big Sight) We would like to express our sincere gratitude for your continued support. Fine Tech Japan will be participating in NEPCON Japan 2022, which will be held from January 19. On that day, we will showcase a live demonstration of the high-precision die bonder lambda2. We will also be available to introduce other models and answer any questions regarding various die bonding techniques, so we sincerely look forward to your visit. NEPCON Japan 2022 Semiconductor and Sensor Packaging Technology Exhibition Dates: January 19 (Wed) - 21 (Fri), 2022 Venue: Tokyo Big Sight, East Hall 3, Booth No. 26-45
