High-precision die bonder femto blu with a mounting accuracy of 2.0μm@3σ.
This is a high-precision die bonding machine with ultra-low load control, fully automatic operation, and compatibility with fine chips. *Technical materials are also available!
This is a die bonder device that supports various bonding processes for prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic components. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers the safety of process gas usage and UV irradiation for operating personnel. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip support • Cost-effective equipment configuration • Compatible with various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.
basic information
*You can download the product catalog and technical documents. *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
