High-precision die bonder and flip chip bonder 'lambda2'

High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

last updated Jul 29, 2024

Technical Data: Flip Chip Bonding to Organic Substrates

Description of the characteristic evaluation of micro-implementation technology! It includes experimental results and discussions.

last updated May 28, 2020

Technical Data: Laser Bonding

This document contains technical information about laser bar bonding!

last updated Jul 28, 2021

Technical Data: Bonding Using Anisotropic Conductive Adhesive

This document contains technical information regarding bonding using anisotropic conductive adhesives!

last updated Aug 06, 2021

Technical Data: Optical Package Assembly

Detailed information on the assembly and bonding of optical packages (optical package products) is provided.

last updated Aug 06, 2021

Technical Data: Multi-Emitter Module Assembly

Detailed information on the assembly and bonding of multi-emitter modules.

last updated Nov 01, 2021

Technical Data: Laser-Assisted Die Bonding

Detailed information on laser-assisted die bonding.

last updated Nov 01, 2021

Technical Data: Assembly of VCSEL and Photodiode

Detailed information on the assembly of VCSELs and photodiodes.

last updated Nov 01, 2021

Technical Data: Heat Press Bonding

Detailed information on hot pressing bonding.

last updated Nov 01, 2021

[Use Case] Implementation and Packaging of Optical Communication Devices

From prototype development to mass production! Ensuring high yield with manufacturing technology.

last updated Jul 01, 2021

[Use Case] High-precision assembly due to high optical resolution

Achieved an optical resolution of 0.7µm!

last updated Jul 01, 2021

[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly

Multiple processes with a single device! Bonding position accuracy of 0.5µm!

last updated Jul 01, 2021

[Application Example] Implementation of VCSEL and PD using a high-precision die bonder.

Bonding position accuracy of 0.5µm!

last updated Jul 01, 2021