[Use Case] Implementation and Packaging of Optical Communication Devices
From prototype development to mass production! Ensuring high yield with manufacturing technology.
Fine Tech specializes in the manufacturing of high-precision die bonding equipment and is constantly pursuing cutting-edge technology. With its innovative know-how, it supports the mounting of fine components. The "FINEPLACER series" allows for flexible addition of bonding processes to manual, semi-automatic, and fully automatic machines, thanks to its modular structure, which is the basic concept of the equipment. The multi-purpose die bonding equipment offers configurations ranging from small-scale production at the prototype research and development level to fully automatic models that cater to production phases with high yield. 【Features】 ■ Mounting accuracy of 0.5μm ■ Based on the technology of the "FINEPLACER series" ■ Easy process transfer ■ Verification of rare processes ■ High-precision mounting facilitates rapid process establishment *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Lineup】 ■ Submicron-compatible high-precision bonding device "FINEPLACER lambda" - Diversified processes and development technologies - Immediate device compatibility - Easy upgrades with a modular system - High cost performance ■ Fully automatic high-precision bonding device "FINEPLACER femto 2" - Fully automatic operating environment - Highly reproducible processes - High-speed throughput compatibility - Compatible with various mounting technologies such as eutectic soldering, adhesive methods, etc. 【Supported Processes】 ■ Thermal compression bonding ■ Thermal/ultrasonic bonding ■ Ultrasonic bonding ■ Eutectic soldering (AuSn, indium, C4) ■ Adhesive methods ■ UV/thermal curing ■ Bump mounting ■ Cu pillar mounting ■ Mechanical assembly *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Flip Chip Bonding ■ High Precision Die Bonding ■ Laser Diodes, Laser Bars ■ Optical Engines, VCSEL/PD ■ LED Bonding ■ Micro Optical Component Assembly ■ MOEMS *For more details, please refer to the PDF document or feel free to contact us.
