[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly
Multiple processes with a single device! Bonding position accuracy of 0.5µm!
The package of optical components consists of the implementation of optical systems (lenses, prisms, apertures, filters, etc.) and electronic components (LD, PD, amplifiers, controllers, etc.). These are widely used in communication technologies where optical signals are converted to electrical signals, or vice versa. High-precision positioning of the optical systems and electronic components during implementation is essential for the normal operation of the package.
basic information
【Fine Tech's Solutions】 ○ Mounting lenses on silicon sub-boards (adhesive bonding) 1. Precisely apply adhesive to the V-shaped groove 2. Precisely mount the lens in the V-shaped groove ○ Mounting TEC on the bottom surface of the package (lead-free soldering method) 1. Place the preform on the bottom surface of the package 2. Mount the TEC on top of the preform 3. Soldering using forming gas ○ Mounting silicon sub-boards on TEC (lead-free soldering method) 1. Place the preform on top of the TEC 2. Adjust the lens and package lens (in X-axis and Y-axis directions) 3. Place the sub-board on top of the preform 4. Soldering using forming gas ○ Attaching flex contacts to the contact strip (thermal compression bonding) 1. Alignment of the mounting surface (in X-axis and Y-axis directions) 2. Mounting the flex contacts onto the TOSA insert using thermal compression method
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Applications/Examples of results
○FINEPLACER Series High-Precision Die Bonding Equipment The high-precision die bonding equipment of the FINEPLACER series flexibly accommodates various mounting applications by adopting a modular system.
