Technical Data: Fully Automated Implementation of High-Power Laser Diodes
Detailed information on fully automated implementation of high-output laser diodes.
With the advancement of laser technology, its range of applications is also expanding. From infrared to ultraviolet, lasers are utilized in various fields such as measurement, spectroscopy, optical communication, optical data processing and storage, fiber optic communication, and medical devices. Moreover, with the increasing demand, the manufacturing of high-power laser diodes, for example, has become one of the main mass production processes. To produce high-power lasers in large quantities, die bonding equipment is required, which must maintain high precision and reproducibility while accommodating variations in the size and type of many different components, and achieving high production efficiency in the assembly of finished products. This technical paper provides an explanation of the fully automated assembly process for high-power laser diodes, including general process parameters, bonding conditions, and process steps, and introduces solutions to typical challenges faced during laser diode manufacturing, such as the bonding quality of Au80Sn20, the bonding process, and various factors arising from materials and components themselves. *For more details, please refer to the PDF document or feel free to contact us.*
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