Full Auto Flip Chip Bonder: femto blu
The FINEPLACER femto blu is a new model of a fully automatic flip chip bonder/die bonder that balances productivity and precision.
This is a die bonder device that supports various bonding processes in prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic parts. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers safety for operators regarding the use of process gases and UV irradiation. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip compatible • Cost-effective equipment configuration • Supports various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.
basic information
*You can download the product catalog and technical documents. *For more details, please refer to the PDF materials or feel free to contact us.
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Applications/Examples of results
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