Full Auto Flip Chip Bonder: femto blu
The FINEPLACER femto blu is a new model of a fully automatic flip chip bonder/die bonder that balances productivity and precision.
This is a die bonder device that supports various bonding processes in prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic parts. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers safety for operators regarding the use of process gases and UV irradiation. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip compatible • Cost-effective equipment configuration • Supports various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.
basic information
*You can download the product catalog and technical documents. *For more details, please refer to the PDF materials or feel free to contact us.
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Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.