Thank you for attending: Nepcon Japan 2022 Autumn @ Makuhari Messe

ファインテック日本

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. ------------------------------------------------- We would like to express our sincere gratitude for your exceptional support. Fine Tech Japan will be exhibiting at NEPCON Japan 2022 (Autumn). On that day, we will be showcasing a live demonstration of the high-precision die bonder lambda2. We will also be introducing other models and addressing any questions related to various die bonding techniques, so we sincerely look forward to your visit. Venue and Booth Number: Makuhari Messe, Hall 2 & 3, A5-30 Dates: August 31, 2022 (Wednesday) to September 2, 2022 (Friday) Time: 10:00 AM to 5:00 PM

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High-precision die bonder and flip chip bonder 'lambda2'
High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

【Main Specifications】 ○ Mounting Accuracy: 0.5μm ○ Optical Field of View Range: 0.54mm×0.43mm (minimum), 6.6mm×5.28mm (maximum) ○ θ Fine Adjustment Range: ±15° ○ Z Height Adjustment Range: 10mm ○ Working Area: 190mm×52mm ○ Load Range: 0.1N to 400N ○ Maximum Heating Temperature: 450℃ ○ Device Size: 660mm×610mm×640mm (main unit) ○ Compatible with formic acid gas processes *For more details, please refer to the catalog or feel free to contact us.

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High-precision die bonder and flip chip bonder 'lambda2'

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