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Thank you for attending: NEPCON Japan 2023 @ Tokyo Big Sight

ファインテック日本

ファインテック日本

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. We would like to extend our sincere appreciation for your exceptional support. Fine Tech Japan will be exhibiting at NEPCON Japan 2023. On the day of the event, we will showcase a live demonstration of the high-precision die bonder lambda2. We will also be available to introduce other models and answer any questions regarding various die bonding processes, so we sincerely look forward to your visit. Exhibition Name: 37th NEPCON Japan [Electronics Development & Manufacturing Show] Dates: January 25 [Wed] - January 27 [Fri], 2023, 10:00 - 17:00 Venue: Tokyo Big Sight Booth Number: East Hall 3, 26-28

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Nepcon Japan - One of the largest electronics development and implementation exhibitions in Asia HP

Related product information

  • High-precision die bonder and flip chip bonder 'lambda2'

    High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

    【Main Specifications】 ○ Mounting Accuracy: 0.5μm ○ Optical Field of View Range: 0.54mm×0.43mm (minimum), 6.6mm×5.28mm (maximum) ○ θ Fine Adjustment Range: ±15° ○ Z Height Adjustment Range: 10mm ○ Working Area: 190mm×52mm ○ Load Range: 0.1N to 400N ○ Maximum Heating Temperature: 450℃ ○ Device Size: 660mm×610mm×640mm (main unit) ○ Compatible with formic acid gas processes *For more details, please refer to the catalog or feel free to contact us.

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