Thank you for attending: Nepco Japan 2024 Autumn @ Makuhari Messe, September 4-6.

ファインテック日本

Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all those who visited us. We look forward to your continued support. ------------------------------------------------- At the Nepco Japan Autumn / Electronics Development and Implementation Exhibition, we will be showcasing our die bonding equipment at our booth. ■■■ Live Demonstration of FINE PLACER lambda2 ■■■ We will be exhibiting the compact tabletop die bonder/flip chip bonder lambda2. Fine Tech offers a wide range of products, from manual models to semi-automatic and fully automatic models. We will introduce high-precision implementation methods and the latest applications for various electronic devices, optical transmission and reception devices, MEMS, and micro components. We apologize for the inconvenience, but if you have time, please feel free to stop by.

Date and time Wednesday, Sep 04, 2024 ～ Friday, Sep 06, 2024
10:00 AM ～ 05:00 PM
Capital Makuhari Messe Hall 2-3 Booth 5-44
Entry fee Free Please register in advance for the WEB.

Related product information

High-precision die bonder and flip chip bonder 'lambda2'
High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

【Main Specifications】 ○ Mounting Accuracy: 0.5μm ○ Optical Field of View Range: 0.54mm×0.43mm (minimum), 6.6mm×5.28mm (maximum) ○ θ Fine Adjustment Range: ±15° ○ Z Height Adjustment Range: 10mm ○ Working Area: 190mm×52mm ○ Load Range: 0.1N to 400N ○ Maximum Heating Temperature: 450℃ ○ Device Size: 660mm×610mm×640mm (main unit) ○ Compatible with formic acid gas processes *For more details, please refer to the catalog or feel free to contact us.
Multipurpose Die Bonder / Flip Chip Bonder "pico 2"
Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

【Other Features】 ■ Observation of running processes ■ Access to all processes and easy visual programming via touchscreen operation ■ Individual configuration through process modules ■ Device variations with options for full auto or semi-auto ■ Wide bonding area *For more details, please refer to the PDF document or feel free to contact us.
High-precision die bonder/flip chip bonder 'sigma'
The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

【Main Specifications】 ○ Mounting Accuracy: ±0.5μm ○ Optical Field of View Range: 3.8mm (expanded 83mm) x 2.7mm ○ Optical Field of View Resolution: 1μm/pix ○ Compatible Chip Size: 0.1mm x 0.1mm to 80mm x 100mm ○ Maximum Compatible Substrate Size: 300mm x 300mm ○ θ Adjustment Range: ±15° (±2° fine adjustment) ○ Z Height Adjustment Range: 10mm ○ Working Area: 440mm x 150mm ○ Maximum Bonding Load: 1000N ○ Maximum Heating Temperature: 450℃ ○ Compatible with Vacuum Chamber Process ● For more details, please contact us or download the catalog.
High-precision flip chip bonder 'femto2'
Fully automatic high-precision die bonding machine

【Main Specifications】 ○ Mounting Accuracy: ±0.3μm @ 3Sigma ○ Optical Field of View: 3.8mm x 2.7mm ○ Optical Field of View Resolution: 1μm/pix ○ Supported Chip Size (Minimum): 0.03mm x 0.03mm to 100mm x 100mm ○ θ Fine Adjustment: ±9°/ 3.5μrad ○ Z Movement / Accuracy: 10mm / 0.2μm ○ Y Movement / Accuracy: 150mm / 0.02μm ○ X Movement / Accuracy: 660mm / 0.02μm ○ Substrate Heating Temperature: 500℃ ○ Bonding Load Range: 0.05N to 1000N *For more details, please contact us or download the catalog.