Technical information regarding the assembly of VCSELs and photodiodes has been made available for free!
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The packaging of optoelectronics (optoelectronic components) units is one of the important applications in microassembly. In the recent field of photonics, multiplex transmitters and receivers with high-density packages targeting high bandwidth, as well as assemblies that combine them, have become crucial elements. Consequently, high placement accuracy is required for the bonding of these components, and various assembly technologies are utilized. This technical paper discusses these challenges and Fine Tech's solutions regarding the assembly of VCSELs and photodiodes, as well as relative high-precision bonding for single components and array components, handling of small components, safe transfer of adhesives, and advanced tool design for components with prohibited contact areas.
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