Adhesive for fixing chip components
Adhesive for fixing chip components
The Seal-glo NE series is an adhesive developed for temporarily fixing chip components. It is a one-component, heat-curing epoxy adhesive that excels in storage stability. The Seal-glo NE series not only has fast curing properties at temperatures of 120 to 150°C in just 1 to 2 minutes, which is required for SMD mounting, but also offers various grades that excel in high-speed dispensing and fine printing to meet your needs.
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Numerous application results of 1005CR! 'Seal-glo Chip Adhesive'
An epoxy-based adhesive developed as a temporary fixing agent for chip components! It reduces the burden on electronic components with low-temperature curing at 90°C for 90 seconds.
last updated
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Chip component fixing adhesive Seal-glo
Numerous application results with 1005CR! 'Seal-glo Chip Adhesive'. Compatible with high-speed dispensers and fine coating regardless of printing!
last updated