One-component low-temperature curing epoxy adhesive Seal-glo LTG800
Low-temperature (80°C and above) curable thermosetting epoxy adhesive! Ideal for bonding resins with low heat resistance.
Seal-glo LTG800 is a one-component heat-curing epoxy adhesive developed to meet the needs for low-temperature and short-time thermal curing, such as fixing LED backlight lenses and bonding resins (like ABS and acrylic) with a heat resistance of below 100°C. 【Features】 - As a low-temperature curing adhesive, it maintains sufficient adhesive strength at 80°C for 3 minutes. - Being a low-temperature thermal curing adhesive, it can reduce production costs during heating. - It does not run or string when dispensed, maintaining a stable application shape. - It is suitable not only for lens fixation but also for bonding between resins, sealing, and glass adhesion. *For more details, please request materials or view the PDF data available for download.
basic information
For more details, please request the materials or view the PDF data from the download.
Price range
Delivery Time
Model number/Brand name
Seal-glo LTG800
Applications/Examples of results
Applications - Bonding of diffusion lenses to LED substrates - Bonding of resin materials to metal materials - Bonding of other heat-sensitive components, etc. Examples of achievements - LCD LED backlight
