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Technical Report: Ultra-thin High-Performance Heat Pipe Cooling Module for Portable Electronic Devices
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"Development of 3D Wiring Forming Technology" awarded the Excellent Presentation Award at the Electronics Packaging Society Conference.
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Introduction of the "FB3BA5 Series" Board to Board Connector for Smart Devices.
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Introducing the industry's smallest level FPC connection connector lineup: 'FFA1W Series'
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Example of heat pipe thermal performance (maximum heat transport capacity Qmax)
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Heat-resistant vinyl ULCSA wire for internal wiring of equipment specifications
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Flat ultra-thin coaxial cable assembly (Specifications: Cable structure / Cable composition)
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Ultra-thin coaxial cable assembly (Specifications: Cable structure/cable composition and characteristics)
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Fujikura Electronic Components and Connectors Division
Official site
![17DE Series D-sub connector [Crimp contact type]](https://image.mono.ipros.com/public/catalog/image/01/eac/772236/IPROS08233191553203676567.jpeg?w=120&h=170)
