フジクラ　　 電子部品・コネクタ事業部門 公式サイト

Starting in May 2025, we began mass production of the "AT7 Series," a gauge pressure high-precision sensor that is among the smallest in the world. The "AT7 Series" is a semiconductor pressure sensor in an ultra-compact 4×4mm package that supports high-resolution digital signal output. The miniaturization of the package and the use of folded leads have achieved space-saving, reducing the mounting area by over 72% compared to our conventional products. It can output a digital signal with an accuracy of ±1.5% FS at temperatures ranging from 0 to +85°C, making it suitable for a wide range of applications, including electrical equipment, medical devices, and industrial equipment. Check out the special site at the related link below!

The CM08 series is a compact round waterproof connector developed for connecting various sensors. By adopting a diameter of 10mm for the M8 screw fitting size and an integrated molded structure, it achieves a smart and compact shape. Using the CM08 series enables a reduction in wiring work and the miniaturization of equipment.

Our company has developed a cable-type piezoelectric sensor by utilizing the design and manufacturing technology of ultra-fine coaxial cables. The cable-type piezoelectric sensor has a cable shape and responds to physical deformation, allowing it to detect various movements such as vibration, impact, bending, stretching, and strain along its entire length. With an outer diameter of just 0.5mm, it is extremely thin, flexible, and lightweight. It does not require power supply and features a coaxial structure, making it highly resistant to noise.

Our company has developed a tower-type vapor chamber for air cooling to address heat dissipation issues caused by the high performance and high density of CPUs/GPUs in data centers, as well as to meet a wide range of customer demands. The tower-type vapor chamber integrates a cylindrical pipe on top of a typical flat vapor chamber, creating a structure that connects the internal space, with heat dissipation fins attached to the cylindrical section. This developed product achieves a 15% reduction in thermal resistance compared to conventional tower-type air cooling units that combine copper plates and heat pipes, and it is an air-cooled solution that can be used in existing data centers without water cooling facilities, achieving performance improvements comparable to water-cooled cooling effects.

Our company received the Excellence Award at the 38th Electronics Spring Conference, hosted by the Japan Society of Electronics Packaging. This award is given for outstanding academic and technical presentations and papers at the conference. In this award, the application of vacuum and pressure forming methods, as well as transfer printing techniques, was recognized for enabling the formation of three-dimensional and multilayer circuits with tail wiring for connection to external terminals on thermoplastic resins such as ABS and polycarbonate.