Development of vapor chamber heat spreaders
Fujikura Electronic Components and Connectors Division
To address heat dissipation due to the high performance and high density of CPUs/GPUs in data centers, and to meet a wide range of requests, we have developed a vapor chamber (VC) heat spreader. The heat spreader is a component that efficiently diffuses and dissipates heat generated from semiconductor chips. It is attached to the chip surface and optimizes heat transfer to cooling devices such as heat sinks and liquid cooling systems, playing a role in suppressing the temperature rise of the chip. Typically made from highly thermally conductive metals like copper or aluminum and having a flat shape, this product incorporates a porous body (wick) utilizing capillary action inside a hollow metal plate and adopts a flat heat pipe structure filled with a working fluid.
