Development of tower-type vapor chambers
Fujikura Electronic Components and Connectors Division
Our company has developed a tower-type vapor chamber for air cooling to address heat dissipation issues caused by the high performance and high density of CPUs/GPUs in data centers, as well as to meet a wide range of customer demands. The tower-type vapor chamber integrates a cylindrical pipe on top of a typical flat vapor chamber, creating a structure that connects the internal space, with heat dissipation fins attached to the cylindrical section. This developed product achieves a 15% reduction in thermal resistance compared to conventional tower-type air cooling units that combine copper plates and heat pipes, and it is an air-cooled solution that can be used in existing data centers without water cooling facilities, achieving performance improvements comparable to water-cooled cooling effects.
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